For heat dissipation of vehicle-mounted intelligent cockpit domain controller, TIF thermal gel is a good choice
The key functions of the intelligent cockpit are integrated on a SOC chip. In the long-term working process, the SOC chip needs to continuously output powerful computing power, resulting in more and more power consumption, resulting in the temperature rise of the chip part. In order to ensure the reliability of SOC, high thermal conductivity and high reliability of heat dissipation solutions are needed. The heat dissipation structure of SOC chip in intelligent cockpit is as follows: chip + thermal conductive interface material + metal shell, and the gap between chip and metal shell is relatively small. In such application scenarios with small gap and limited space, thermal conductive gel solution is recommended.
TIF two-component thermal conductive gel:
Thermal conductivity: 1.5~5.0W/mK, after mixing in equal proportion of two components, it can be completely cured at room temperature. Increasing the temperature can shorten the curing time, which is conducive to shortening the production cycle. After curing, there will be a certain bonding effect with the contact interface, and it has good mechanical properties.
There will be no vertical flow problem in the long-term use process, and there will be no position slip under the vibration condition. In liquid form, provide a variety of thickness, replace the general thermal pad die-cutting thickness, and different from the general silicone sheet, this series of products after curing is dry and touchable, so can be more widely used.
TIF single component thermal conductive gel:
Thermal conductivity: 1.5~7.0W/mk, look like thermal grease, formed with the structure, can use automatic dispensing equipment to achieve accurate distribution of glue, greatly reduce the waste of materials. Low thermal impedance, conforming to UL94V0 fire rating. Its adhesion line offset is also better controlled than the traditional heat dissipation pad. In addition, automated production is conducive to improving production efficiency and saving labor costs.
Contact Person: Miss. Dana
Tel: +86 18153789196